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Adjust tsens thermal zone tip thresholds for RB3 boards.

@quic-manafm
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LGTM

…e configuration

The QCS6490 rb3gen2 board uses the same Qualcomm QCM6490 platform
but has a different thermal junction temperature specification
due to package-level differences.

Update passive/hot trip thresholds to 105°C and critical trip
thresholds to 115°C for various subsystem TSENS sensors.

Disable CPU cooling maps for CPU TSENS since CPU thermal mitigation
is handled automatically in hardware on this board.

Signed-off-by: Manaf Meethalavalappu Pallikunhi <manaf.pallikunhi@oss.qualcomm.com>
Link: https://lore.kernel.org/r/20251215105934.2428987-1-manaf.pallikunhi@oss.qualcomm.com
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